P-1750 IMU

Versatile, Highly Accurate FOG-based IMU with Photonic Integrated Chip (PIC) Technology for Demanding Applications

The new KVH P-1750 IMU is a versatile, high-performance, non-ITAR IMU featuring breakthrough PIC technology for increased reliability and upgraded high-performance accelerometers for superior performance for autonomous and manned platforms.

The P-1750 IMU integrates easily into the most demanding applications including autonomous vehicle navigation and positioning; unmanned aerial surveillance, surveying and mapping; humanoid robots; and oil and gas pipeline inspection equipment.

Features:
  • Drop-in replacement IMU for easy integration
  • Offers outstanding resistance to shock and vibration
  • Available with 10g, 16g, or 30g high-grade accelerometers
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New P-1750 IMU
P-1750 IMU undersea
P-1750 IMU helicopter
P-1750 IMU

Highlights


  • Superior precision – Bias Instability ≤ 0.05°/hr, 1σ
  • Choice of 10g, 16g or 30g high-performance accelerometers
  • Full differential asynchronous or synchronous RS-422 protocol
1725 IMU
  • Flexible, user-friendly programmable data output rates from 1 – 1000 Hz
  • Customizable message output from both the photonic FOGs and the integrated accelerometers
  • Rugged design for extreme environments, with excellent shock, vibration, and thermal performance

Technology Details


Exclusive Technology


Photonic Integrated Chip Technology
KVH’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside that’s even more reliable and delivers superior repeatability unit-to-unit.

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DSP Technology
KVH’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. KVH’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors.

Precision Testing


We rigorously test our new PIC technology to ensure superior performance, accuracy, and reliability.

  • Part Level – Testing includes over temperature cycling, temperature and humidity, and shock and vibration, all run over multiple lots of parts to validate the repeatability and robustness of manufacturing
  • Product Level – Testing is done across the complete set of performance specifications and environmental conditions and repeated over time to validate the design

KVH engineer performing tests on the photonic chip

Product Literature/Supporting Documents


Need more information about this product and how customers are using it to succeed? Check out all of the supporting materials for this product, including brochures, specification sheets, rate plans, case studies, eBooks, and more.

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Product Literature and Supporting Documents


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